Systèmes d'automatisation industrielle et intégration — Représentation et échange de données de produits — Partie 1650: Module d'application: Matrice nue

ISO/TS 10303-1650:2018-11 specifies the application module for
Bare die.

The following is within the scope of
ISO/TS 10303-1650:2018-11:

The
representation of the information needed to describe a semiconductor material product
that is an integrated circuit component, or that may be a discrete active component,
or that may be included as a component in an electronic assembly.
Terminal information is supported, including explicit shape data.
A bare die usually refers to semiconductor substrates that are traditionally considered protected by a container, called
a package.

• definition of the minimum content model of an interface control definition of a bare die, including its terminals, behavioural
  simulation model, and shape.